ST
Back to salariesOFFERED BASE WAGE · FILING COHORTPrincipal Engineer, Packaging Engineering
Sandisk Technologies, Inc.
Principal Engineer, Packaging Engineering
compensation breakdown.
Sandisk Technologies, Inc.All reported locationsFY 2026 filings6 filings
$170,248 USD / year
Employer-offered annual base wages in this filing cohort.
Base salary$170,248
Published median for the matching cohort.
Stock per yearNot disclosed
No amount is inferred for this component.Annual cash bonusNot disclosed
No amount is inferred for this component.Total compensationNot disclosed
No amount is inferred for this component.These are median statistics for a group, rather than one person’s offer. Components are matched by employer, role, level, location, currency and reporting period; component medians may not add to the total.
Pay distribution
Base salary · All reported locations · USD
25th percentile$161,808Within this matching cohort
Median$170,248Within this matching cohort
75th percentile$174,944Within this matching cohort
A missing component stays unknown.
Contribute a report Signing bonuses, deferred awards and benefits are not assumed from these annual pay figures. A missing component never means zero.